Wiley_ADVANCED FUNCTIONAL MATERIALS

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Wiley_ADVANCED FUNCTIONAL MATERIALS

Volume33, Issue19

May 8, 2023

2370121


Photopatternable High-k Polysilsesquioxane Dielectrics for Organic Integrated Devices: Effects of UV Curing on Chemical and Electrical Properties

In article number 2214865, Insik In, Yong Jin Jeong, Se Hyun Kim, and co-workers prepare two types of UV-curable high-dielectric-constant polysilsesquioxanes by introducing epoxy-containing side chains: 1) glycidyl epoxy-containing linear groups and 2) bulky cycloaliphatic epoxy-containing groups. The structure of the side chains influenced the UV curing behavior and capacitance characteristics of polysilsesquioxanes. These polysilsesquioxanes are used to implement logic gates and memory cells exhibiting low-voltage and non-destructive operations.



  • Heqing Ye
  • Eunji Park
  • Su Cheol Shin
  • G. Murali
  • Daehyun Kim
  • Jihoon Lee
  • In Ho Kim
  • Sung-Jin Kim
  • Se Hyun Kim
  • Yong Jin Jeong
  • Insik In


https://onlinelibrary.wiley.com/toc/16163028/2023/33/19


Image created by minjeong Kim / Nanosphere